Composite EMI shield having clean, highly conductive surfaces fo

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

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428166, 428458, 428134, 428139, 428140, 428246, 428247, 428256, 428408, 428290, 428251, 428252, 428268, 428433, 4284752, 428344, 428 41, 428 42, 361218, 174 35R, 174 35MS, B32B 318, B32B 3118, H05K 900

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052503429

ABSTRACT:
An EMI shield is disclosed for providing EMI protection. The shield is lightweight, and easily moldable into complex shapes, having conductive mating surfaces provided on opposite sides thereof. The clean, highly conductive mating surfaces are part of an embedded aluminum wire mesh sandwiched between at least two face plies which add strength to the shield. By sandwiching the metal mesh alternately with a nonporous tape, and a barrier tape ply, clean conductive areas can be provided on either side of the shield, easing attachment to adjacent structures. During curing, the tapes prevent direct resin inclusion into the metal mesh. After curing, the nonporous tape is removed to expose the clean, highly conductive mating surfaces.

REFERENCES:
patent: 3247574 (1966-04-01), Wirtz
patent: 3350497 (1967-10-01), Weaver et al.
patent: 3755713 (1973-05-01), Paszkowski
patent: 4608453 (1986-08-01), Freeman
patent: 4649461 (1987-03-01), Matsuta
patent: 4746389 (1988-05-01), DiGenova

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