Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Reexamination Certificate
2006-02-28
2006-02-28
Ngo, Hung V. (Department: 2831)
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
C174S034000, C361S816000
Reexamination Certificate
active
07005573
ABSTRACT:
An EMI shield having at least one compartment for enclosing circuitry of an electronic device. The shield includes a first member formed of a first material such as a thin metal sheet or screen, or a metal-plated fabric or other electrically-conductive mesh, and a second member formed of a second material different than the first material which second material is an admixture of a plastic or other polymeric component and an electrically-conductive particulate filler component. The second member is integrally joined to the first member, and has at least one wall which extends from the first member and which together with the first member defines at least a portion of the compartment.
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CHO-VER SHIELD™ Shielding Plastic Cover with Molded Conductive Elastomeric Gasket (1999).
Chomerics Conductive Elastomers—Molded-in-Place Cover Seals. Applicants request the Examiner to consider this reference as prior art under 102(a), however, Applicants respectfully reserve the right to supplement this Information Disclosure Statement and take a contrary position should it be necessary.
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“CHO-SHIELD® Conductive Compounds;” “CHO-SHIELD® EMI Shielding Covers,” Technical Bulletin 22, (1996).
“CHO-SHIELD® 2052 Conductive Coating,” Technical Bulletin 48, (2000.).
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Lionetta William G.
Nobbs Douglas
Rich David C.
Severance Christopher L.
Stiffler Robert E.
Molnar, Jr. John A.
Ngo Hung V.
Parker-Hannifin Corporation
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