Composite electronic substrate of alumina uniformly needled thro

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264 24, 264 61, 264 63, 264 86, 264175, 357 81, B32B 508, B32B 1900, C04B 3314, C04B 3558, H01L 2336

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042567920

ABSTRACT:
An aluminum oxide-aluminum nitride composite electronic substrate with anisotropic thermal properties is described. The aluminum nitride is in the form of needles incorporated into the aluminum oxide, the needles being oriented or aligned through the thickness of the substrate parallel to the short transverse direction of the substrate. The substrate has improved thermal conductivity in the short transverse direction and yet maintains good dielectric strength across the surface of the substrate. The improved thermal conductivity is required for heat dissipation from the micropackage assembly.

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