Composite electronic component

Details Composite electronic component Composite electronic component

2007-03-06

2007-03-06

Le, Thao X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S207000, C257SE23079, C257SE23153

Reexamination Certificate

active

10565569

ABSTRACT:
A composite electronic component having a multi-layer wiring board, a first power terminal electrode, a second power terminal electrode, an external connection power supply terminal, a surface-mounted component, an insulator, and a power supply pattern. The first and the second power terminal electrodes are disposed on a first face of the multi-layer wiring board. The external connection power supply terminal is disposed on a second face opposite to the first face of the multi-layer wiring board and connected with the first power terminal electrode. The surface-mounted component is mounted on the first face of the multi-layer wiring board and connected with the first and the second power terminal electrodes at a first face thereof. The insulator covers at least a second face opposite to the first face of the surface-mounted component, the first power terminal electrode, and the second power terminal electrode with a first face thereof. The power supply pattern is disposed on a second face opposite to the first face of the insulator and connected with the first and the second power terminal electrodes.

REFERENCES:
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patent: 7095117 (2006-08-01), Suwa et al.
patent: 7129571 (2006-10-01), Kang
patent: 2003/0194832 (2003-10-01), Lopata et al.
patent: 2004/0232452 (2004-11-01), Tsuneoka et al.
patent: 2004/0252475 (2004-12-01), Tsuneoka et al.
patent: 05-500136 (1993-01-01), None
patent: 05-315470 (1993-11-01), None
patent: 2002-151633 (2002-05-01), None
patent: 2004-297054 (2004-10-01), None
Japanese Search Report for PCT/JP2005-008140, dated Aug. 9, 2005, with English translation.

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