Composite electronic component

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S763000, C361S766000, C361S792000

Reexamination Certificate

active

07929316

ABSTRACT:
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

REFERENCES:
patent: 6680441 (2004-01-01), Kondo et al.
patent: 6803324 (2004-10-01), Ogawa et al.
patent: 2003/0060172 (2003-03-01), Kuriyama et al.
patent: 2003/0137045 (2003-07-01), Sugaya et al.
patent: 2004/0077124 (2004-04-01), Ogawa
patent: 2002-261449 (2002-09-01), None
patent: 2002-271038 (2002-09-01), None
patent: 2002-290051 (2002-10-01), None
patent: 2003-100937 (2003-04-01), None
patent: 2003-163459 (2003-06-01), None
Noda et al.; “Composite Electronic Component”; U.S. Appl. No. 11/609,989, filed Dec. 13, 2006.
Noda et al.; “Method of Manufacturing Composite Electronic Component”, U.S. Appl. No. 11/691,666, filed Mar. 27, 2007.
Official Communication issued in corresponding European Patent Application No. 05780155.7, mailed on Aug. 18, 2010.
Officail Communication issued in corresponding Japanese Patent Application No. 2006-527819, drafted on Aug. 7, 2009.

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