Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-04-19
2011-04-19
Dinh, Tuan T (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S766000, C361S792000
Reexamination Certificate
active
07929316
ABSTRACT:
A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.
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Officail Communication issued in corresponding Japanese Patent Application No. 2006-527819, drafted on Aug. 7, 2009.
Harada Jun
Noda Satoru
Dinh Tuan T
Keating & Bennett LLP
Murata Manufacturing Co. Ltd.
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