Composite dough product and a process for producing same

Details Composite dough product and a process for producing same Composite dough product and a process for producing same

1991-07-05

1993-03-09

Hunter, Jeanette

Food or edible material: processes, compositions, and products

Fermentation processes

Of farinaceous cereal or cereal material

426 21, 426 94, 426249, 426275, A21D 1000

Patent

active

051925648

ABSTRACT:
The present invention describes a composite dough mass for producing a baked product comprising an inner dough portion and an outer dough portion, wherein the outer dough comprises a conventional leavened dough and the inner portion comprises a leavened dough with less oven spring than the outer dough portion. The composite material provides a means of producing a baked product of comparable quality to a product which employs only leavened dough of good baking characteristics. The present invention provides a means of adding to the inner dough portion a significant level of a fibrous additive such as soy polysaccharide or cellulosic material, to provide a bread of reduced calories, yet produce a product of acceptable oven spring bread of the composite dough material.

REFERENCES:
patent: 3372654 (1968-03-01), Bell
patent: 3524401 (1970-08-01), Hosfield et al.
patent: 3689280 (1972-09-01), Werner
patent: 3917856 (1975-11-01), Wong et al.
patent: 4711786 (1987-12-01), Schmidt
patent: 4719117 (1988-01-01), Simelunas
patent: 4741907 (1988-05-01), Furuhashi
patent: 4892762 (1990-01-01), Abdelrahman

Affiliated with

Also associated with

Rating

Composite dough product and a process for producing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite dough product and a process for producing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite dough product and a process for producing same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-209831