Composite dielectric structure for optimizing electrical perform

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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428435, H05K 100

Patent

active

049162594

ABSTRACT:
The disclosure describes a technique whereby the electrical characteristics of an electrical circuit in a package may be adjusted to a predetermined value by changes in the dielectric structure between two levels of circuitry.
This adjustment in the composite dielectric structure is accomplished by changes in the electrical properties of the composite dielectric material, one level being preset to a value and the other level being adjusted by alterations of predetermined amounts that depend upon the performance desired.

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Abolafia, O. R. et al., Use of Polyimide to Obtain a Smooth Surface; IBM Technical Disclosure Bulletin; vol. 20, No. 8; Jan. 1978; p. 3020.

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