Composite dielectric layers

Details Composite dielectric layers Composite dielectric layers

2005-04-05

2005-04-05

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S210000, C257S211000, C257S759000, C257S760000

Reexamination Certificate

active

06876081

ABSTRACT:
An apparatus including a contact point formed on a device layer of a circuit substrate or interconnect layer on a substrate; a first dielectric layer including cubic boron nitride on the substrate; and a different second dielectric layer on the substrate and separated from the device layer by the first dielectric layer. Also, an apparatus including a circuit substrate including a device layer and a composite dielectric layer. The composite dielectric includes a first dielectric material including cubic boron nitride and a different second dielectric material. The first dielectric material surrounds the second dielectric material.

REFERENCES:
patent: 5081053 (1992-01-01), Heremans et al.
patent: 6726996 (2004-04-01), Barth et al.
patent: 20020000556 (2002-01-01), Sakamoto et al.
patent: 20020003238 (2002-01-01), Ramdani et al.

Affiliated with

Also associated with

Rating

Composite dielectric layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite dielectric layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite dielectric layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3442543