Composite dielectric and printed-circuit use substrate utilizing

Details Composite dielectric and printed-circuit use substrate utilizing Composite dielectric and printed-circuit use substrate utilizing

1991-01-31

1994-01-04

Ryan, Patrick J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

4283044, 4283142, 4283184, 4283193, 428340, 525534, 525390, 528219, C08F 2300

Patent

active

052758788

ABSTRACT:
A composite dielectric is formed with a matrix synthetic resin and particulate porous, inorganic dielectric dispersed in the matrix synthetic resin. The dielectric constant of this composite dielectric can be thereby elevated effectively without enlarging the dissipation factor (tan .delta.) of the composite dielectric.

REFERENCES:
patent: 4227111 (1980-10-01), Cross et al.
patent: 4330593 (1982-05-01), Shrout et al.
patent: 4518737 (1985-05-01), Traut
patent: 4686409 (1987-08-01), Kaarmann et al.
patent: 4874030 (1989-10-01), Kuphal et al.
patent: 4874826 (1989-10-01), Sakamoto et al.

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