Composite diamond wire die

Metal deforming – Tool and/or tool holder – Tool comprising closed periphery deforming passageway

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B21C 300

Patent

active

056343698

ABSTRACT:
A composite diamond wire die for drawing wire has a single crystal or HTHP diamond substrate and a CVD layer or layers deposited thereon. The wire die bore extends through both the substrate and the CVD layers, with the wire bearing surface being located within the substrate.

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