Composite copper nickel alloys with improved solderability shelf

Details Composite copper nickel alloys with improved solderability shelf Composite copper nickel alloys with improved solderability shelf

1983-01-13

1984-04-03

Lewis, Michael L.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 52FP, 174126CP, 357 67, 428643, 428675, 428929, H01L 2348, H01L 2946, H01L 2954, H01L 2962

Patent

active

044411189

ABSTRACT:
A composite structure having improved solderability shelf life and contact resistance is formed by coating a copper alloy substrate material with a tin-containing material. The copper alloy substrate material consists essentially of about 15% to about 30% nickel and the balance essentially copper. The copper alloy may further include up to about 25% zinc. The nickel in the alloy retards the growth of copper-tin and/or copper-zinc-tin intermetallic compounds and the diffusion of the copper through the coating. The coating may be formed from tin or tin alloys including tin solders, e.g. 60% Tin-40% lead solder.

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LaQue, F. L., "Galvanic Behavior of Tin Dipped Coatings on Copper Alloys", Corrosion, vol. 8, No. 4, Apr. 1952, p. 1.
Unsworth, D. A. et al., "A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated With Tin and its Alloys", Transactions of the Institute of Metal Finishing, Summer, 1973, pp. 85-90.
Cubberly, W. H. et al; Metals Handbook, vol. 2, 9th edition, pp. 619-621.

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