Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-03-19
2011-10-25
Graybill, David (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S698000, C257S727000, C257S729000, C257S730000, C257S731000, C257SE23023, C257SE23151
Reexamination Certificate
active
08044502
ABSTRACT:
An electrical interconnect assembly for electrically interconnecting terminals on a first circuit member with terminals on a second circuit member. The electrical interconnect includes a housing having a plurality of through openings extending between a first surface and a second surface. A plurality of composite contacts are positioned in a plurality of the through openings. The composite contacts include a conductive member having a central portion and at least first and second interface portions. One or more polymeric layers extend along at least the central portion conductive member. One or more coupling features on the composite contacts engage with the housing. At least one engagement feature formed in the polymeric layers proximate the first interface portion mechanically couples with the terminals on the first circuit member.
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International Search Report and Written Opinion of international application No. PCT/US2007/064298, mailed Sep. 10, 2007, 11 pp.
Faegre & Benson LLP
Graybill David
Gryphics, Inc.
LandOfFree
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