Composite conductive structures in integrated circuits

Details Composite conductive structures in integrated circuits Composite conductive structures in integrated circuits

1979-06-11

1980-10-14

Kendall, Ralph S.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 148 6, 148 315, 427 88, 427 91, 427 93, 357 67, 357 71, H01L 21283

Patent

active

042282128

ABSTRACT:
A composite conductive structure in integrated circuit devices is described. The composite conductive structure includes an insulating substrate on which is provided a conductor of a refractory metal substantially nonreactive with silicon dioxide. A layer of a silicide of the refractory metal covers the conductor and a layer of silicon dioxide covers the layer of the silicide. A method of making such structures is also described.

REFERENCES:
patent: 3375418 (1968-03-01), Garnache et al.
patent: 4109372 (1978-08-01), Geffken
patent: 4128670 (1978-12-01), Gaensslen

Affiliated with

Also associated with

Rating

Composite conductive structures in integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite conductive structures in integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite conductive structures in integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2101443