Composite conductive film and semiconductor package using...

Details Composite conductive film and semiconductor package using... Composite conductive film and semiconductor package using...

2011-04-26

2011-04-26

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S784000, C257S700000, C257SE23007

Reexamination Certificate

active

07932607

ABSTRACT:
A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity. The present conductive film can be served as an electrical connection between a fine-pitch chip and a chip or a fine-pitch chip and a substrate

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