Composite circuit board having means to suppress heat diffusion

Details Composite circuit board having means to suppress heat diffusion Composite circuit board having means to suppress heat diffusion

1990-11-19

1993-06-29

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 29846, H05K 100

Patent

active

052236765

ABSTRACT:
The composite circuit board comprises a substrate made of an insulating material, a thick circuit conductor, embedded in this substrate, which includes a given portion for connecting components to the thick circuit conductor and has a predetermined circuit pattern, a thin circuit conductor, provided on the surface of the substrate, which includes a land corresponding to the parts-mounting section of the thick circuit conductor and has a predetermined circuit pattern, and a conductor for electrically connecting the land and the given portion of the thick circuit conductor. In this circuit board, the land and the given portion of the thick circuit conductor are connected by a conducting member provided in the through hole.

REFERENCES:
patent: 4446188 (1984-05-01), Patel et al.
patent: 4521262 (1985-07-01), Pellegrino
patent: 4694120 (1987-09-01), Accon
patent: 4729061 (1988-03-01), Brown
patent: 4845313 (1989-07-01), Endoh et al.
patent: 4854038 (1989-08-01), Wiley
patent: 4859807 (1989-08-01), Swiggett
patent: 4866571 (1989-09-01), Butt
patent: 4972050 (1990-10-01), Hammond

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