Composite ceramic substrate for micro-fluid ejection head

Details Composite ceramic substrate for micro-fluid ejection head Composite ceramic substrate for micro-fluid ejection head

2011-05-10

2011-05-10

Lam, Cathy (Department: 1784)

Metal working

Method of mechanical manufacture

Fluid pattern dispersing device making, e.g., ink jet

C029S846000, C029S851000, C347S056000, C347S063000, C347S065000

Reexamination Certificate

active

07937835

ABSTRACT:
A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.

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R. Kulke, M. Rittweger, P. Uhlig, and C. Gunner, “LTCC Multilayer Ceramic for Wireless and Sensor Applications,” LTCC—An Introduction and Overview, IMST GmbH, Dec. 2001, pp. 1-8.

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