Composite ceramic board and process for the productivity thereof

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component

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264628, 264641, 264643, 427238, 427294, 4283126, 4283157, 4283191, 4283193, B32B 326, B32B 518, B05D 722, C04B 3564

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059254513

ABSTRACT:
A composite ceramic board having a low dielectric constant and a low heat expansion coefficient and being suitable for use as a heat-resistant material having a high dimensional accuracy and a low dielectric constant, which is formed of a sintered substrate (II) having a thickness of 0.2 to 10 mm and a thermosetting resin (R) which is integrated into the sintered substrate (II) by being impregnated into pores of the sintered substrate (II) under vacuum and cured, the sintered substrate (II) being a substrate obtained from an inorganic continuous porous sintered body (I) produced by sintering a spherical inorganic powder having an average particle diameter of 0.1 to 10 .mu.m in the presence of a sintering aid, the sintered inorganic powder substantially retaining the spherical forms, the inorganic continuously porous sintered body (I) having an average pore diameter of 0.1 to 10 .mu.m, a true porosity of 8 to 35% and a closed porosity of 2% or less.

REFERENCES:
patent: 3688832 (1972-09-01), Horton
patent: 4882455 (1989-11-01), Sato et al.
patent: 5531945 (1996-07-01), Ohya et al.
patent: 5686172 (1997-11-01), Ohya et al.

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