Composite boat transport providing clipless securement of semico

Metal fusion bonding – Including means to force or clamp work portions together...

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Details

228 47, 228212, 269 8, B23K 300

Patent

active

052113248

ABSTRACT:
A magnet is disposed in proximity to an un-lidded semiconductor package being assembled. When a ferrous lid is placed over the package opening, the magnetic field holds the lid in place, and also holds the package on an assembly boat carrying the package through an oven for hermetic sealing.

REFERENCES:
patent: 4489923 (1984-12-01), Barresi et al.
patent: 4558812 (1985-12-01), Bailey et al.
patent: 4859498 (1989-08-01), Yamaguchi
patent: 5103367 (1992-04-01), Horwitz et al.

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