Composite alumina-aluminum nitride circuit substrate

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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428627, 428662, 428663, 428665, 428674, 428901, 357 67, 357 71, B32B 1504

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048350656

ABSTRACT:
Disclosed is a circuit substrate comprising an alumina plate and an aluminum nitride plate bonded to the alumina plate through metallized layers formed on the respective bonding surfaces of the alumina plate and the aluminum nitride plate and a buffering layer provided between the metallized layers, the buffering layer being of a metallic material

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patent: 4591537 (1986-05-01), Aldinger et al.
patent: 4761345 (1988-08-01), Sato et al.
patent: 4770953 (1988-09-01), Horiguchi et al.
R. A. Jarvela, IBM Technical Disclosure Bulletin, "Low-Cost, Large-Scale Integration Single Chip Module Package", vol. 18, No. 11, Apr. 1976.
Nobuyuki Mizunoya, Patent Abstracts of Japan, "Circuit Substrate", vol. 10, No. 145 (E-407) [2202], May 28, 1986.
H. Takashio, "Alumina Ceramic-to-Metal Seals by the Mo-Mn Process Yogyo-Kyokai-Shi", 79(9)1971, pp. 330-339.

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