Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1987-07-08
1989-05-30
Rutledge, L. Dewayne
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
428627, 428662, 428663, 428665, 428674, 428901, 357 67, 357 71, B32B 1504
Patent
active
048350656
ABSTRACT:
Disclosed is a circuit substrate comprising an alumina plate and an aluminum nitride plate bonded to the alumina plate through metallized layers formed on the respective bonding surfaces of the alumina plate and the aluminum nitride plate and a buffering layer provided between the metallized layers, the buffering layer being of a metallic material
REFERENCES:
patent: 3457052 (1969-07-01), Carlson et al.
patent: 4480013 (1984-10-01), Doi et al.
patent: 4580714 (1986-04-01), Mayer et al.
patent: 4591537 (1986-05-01), Aldinger et al.
patent: 4761345 (1988-08-01), Sato et al.
patent: 4770953 (1988-09-01), Horiguchi et al.
R. A. Jarvela, IBM Technical Disclosure Bulletin, "Low-Cost, Large-Scale Integration Single Chip Module Package", vol. 18, No. 11, Apr. 1976.
Nobuyuki Mizunoya, Patent Abstracts of Japan, "Circuit Substrate", vol. 10, No. 145 (E-407) [2202], May 28, 1986.
H. Takashio, "Alumina Ceramic-to-Metal Seals by the Mo-Mn Process Yogyo-Kyokai-Shi", 79(9)1971, pp. 330-339.
Mizunoya Nobuyuki
Sato Hideki
Kabushiki Kaisha Toshiba
Rutledge L. Dewayne
Wyszimiersmi George
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