Composing packages of electronic mail attachments

Electrical computers and digital processing systems: multicomput – Computer conferencing – Demand based messaging

Reexamination Certificate

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Details

C709S207000, C709S201000, C709S219000, C709S204000, C707S793000

Reexamination Certificate

active

07627637

ABSTRACT:
The present invention is directed to a method and system for composing a package of application files to be sent as e-mail attachments in e-mail communications. A plurality of data structures are created, wherein each data structure groups together a plurality of different user application files designated as attachments to an e-mail communication. Application files designated from within user applications are associated with selected data structures, such that each designated application file is associated with a selected data structure. During composition of an e-mail communication having attachments, a list of the data structures containing application files are provided.

REFERENCES:
patent: 5418908 (1995-05-01), Keller et al.
patent: 5781901 (1998-07-01), Kuzma
patent: 5870089 (1999-02-01), Fabbio et al.
patent: 5903723 (1999-05-01), Beck et al.
patent: 6073133 (2000-06-01), Chrabaszcz
patent: 6212553 (2001-04-01), Lee et al.
patent: 6272485 (2001-08-01), Sragner
patent: 6360252 (2002-03-01), Rudy et al.
patent: 6405225 (2002-06-01), Apfel et al.
patent: 6460074 (2002-10-01), Fishkin
patent: 6505237 (2003-01-01), Beyda et al.
patent: 6859213 (2005-02-01), Carter
patent: 6898622 (2005-05-01), Malik
Southwest Missouri State University; “Introduction to Microsoft”, Computer Services, Southwest Missouri State University, Springfield, MO; 1998; 39 pages.
Malik; U.S. Appl. No. 09/563,931, filed May 4, 2000.
Malik; Non-Final Rejection mailed Mar. 25, 2003 for U.S. Appl. No. 09/563,931, filed May 4, 2000.
Malik; Final Rejection mailed Sep. 8, 2003 for U.S. Appl. No. 09/563,931, filed May 4, 2000.
Malik; Advisory Action mailed Dec. 19, 2003 for U.S. Appl. No. 09/563,931, filed May 4, 2000.
Malik; Restriction Requirement mailed Mar. 22, 2004 for U.S. Appl. No. 09/563,931, filed May 4, 2000.
Malik; Notice of Allowance and Fees Due mailed Jul. 12, 2004 for U.S. Appl. No. 09/563,931, filed May 4, 2000.

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