Composable system-in-package integrated circuits and process...

Details Composable system-in-package integrated circuits and process... Composable system-in-package integrated circuits and process...

2005-03-14

2009-02-17

Everhart, Caridad M (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S684000, C257SE21499, C257SE23010, C257SE21705

Reexamination Certificate

active

07491579

ABSTRACT:
An SIP for performing a plurality of hard and soft functions comprises standard IC die and custom platforms mounted to a substrate. Die are identified for each standard hard function, such as memory, processing, I/O and other standard functions and one or more user-configurable base platforms are selected that, when configured, execute the custom soft functions. Optionally, the substrate is laminated to the die and the platforms are attached to the substrate. Testing is performed by defining the configured base platforms coupled to logic representing the die and their connections and performing placement and timing closure on the combination.

REFERENCES:
patent: 2002/0026539 (2002-02-01), Muthukumaraswamy
patent: 2002/0066956 (2002-06-01), Taguchi
patent: 2002/0122386 (2002-09-01), Calvignac
patent: 2003/0062922 (2003-04-01), Douglass
patent: 2004/0015502 (2004-01-01), Alexander et al.
patent: 2006/0036774 (2006-02-01), Schott et al.
Dave Bursky, “Platforms Get Extreme for Storage, High-Speed I/O”, Electronic Design, Nov. 29, 2004 www.elecdesign.com (3 pages).
Roger Allan, “SiP Really Packs It In”, Electronic Design, Nov. 29, 2004 www.elecdesign.com (9 pages).

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