Components for housing an integrated circuit device

Details Components for housing an integrated circuit device Components for housing an integrated circuit device

1994-03-29

1996-11-26

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257693, 257713, 257730, 257784, H01L 2352, H01L 2334, H01L 2348, H01L 2304

Patent

active

055788696

ABSTRACT:
There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.

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