Dynamic information storage or retrieval – Storage or retrieval by simultaneous application of diverse... – Magnetic field and light beam
Reexamination Certificate
2011-07-26
2011-07-26
Neyzari, Ali (Department: 2627)
Dynamic information storage or retrieval
Storage or retrieval by simultaneous application of diverse...
Magnetic field and light beam
C369S013170, C369S013120, C369S112270
Reexamination Certificate
active
07986592
ABSTRACT:
Components for, and assembly of, a thermally assisted recording device involve a laser mounted to a recording head slider. The output from the laser is directed into an optical waveguide, which delivers the laser light to the media to be written. Several challenges with thermally assisted recording are enabled by the use of a laser carrier, which holds and protects the small, relatively fragile laser and serves as a partial heat sink for the power generated by the laser. The laser, carrier and slider are bonded and can be interconnected as a unit to a suspension constituent to a hard disk drive (HDD) device.
REFERENCES:
patent: 4854667 (1989-08-01), Ebata et al.
patent: 5199090 (1993-03-01), Bell
patent: 6181673 (2001-01-01), Wilde et al.
patent: 6492614 (2002-12-01), Murdza et al.
patent: 6724718 (2004-04-01), Shinohara et al.
patent: 6771589 (2004-08-01), Ueyanagi et al.
patent: 6775100 (2004-08-01), Belser et al.
patent: 6795380 (2004-09-01), Akiyama et al.
patent: 6807141 (2004-10-01), Chang et al.
patent: 6944112 (2005-09-01), Challener
patent: 6996033 (2006-02-01), Dugas et al.
patent: 7345316 (2008-03-01), Sherrer et al.
patent: 7483229 (2009-01-01), Rausch et al.
patent: 7688689 (2010-03-01), Gage et al.
patent: 2005/0190682 (2005-09-01), Gage et al.
patent: 2006/0187564 (2006-08-01), Sato et al.
patent: 2006/0233061 (2006-10-01), Rausch et al.
patent: 2007/0081427 (2007-04-01), Suh et al.
patent: 2003045004 (2003-02-01), None
patent: 2006053976 (2006-02-01), None
Hirano Toshiki
Reiley Timothy C.
Stipe Barry C.
Hitachi Global Storage Technologies - Netherlands B.V.
Neyzari Ali
LandOfFree
Components and assembly procedure for thermal assisted... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Components and assembly procedure for thermal assisted..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Components and assembly procedure for thermal assisted... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2687385