Component with bonding adhesive

Details Component with bonding adhesive Component with bonding adhesive

2007-11-14

2011-12-27

Norris, Jeremy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S783000

Reexamination Certificate

active

08084693

ABSTRACT:
A device comprising a component and an adhesive attached to at least one exterior portion of the component. When the component is on a printed circuit and passed through a reflow operation, the adhesive melts forming a physical bond between the component and the printed circuit. The printed circuit may be a flexible printed circuit or a printed circuit board. The adhesive may melt under and to at least one edge of the component. The adhesive may also melt under and to at least one edge of the component and under and to at least one edge of at least one second component adjacent to the component.

REFERENCES:
patent: 4489487 (1984-12-01), Bura
patent: 4829663 (1989-05-01), Masujima et al.
patent: 6228197 (2001-05-01), Wang
patent: 6369450 (2002-04-01), Amani et al.
patent: 2004/0159462 (2004-08-01), Chung
patent: 2007/0234561 (2007-10-01), Lin et al.
patent: 200739848 (2007-10-01), None
International Preliminary Report on Patentabilty, corresponding to International Patent Application No. PCT/US2008/065618, dated Feb. 12, 2010.
International Search Report, corresponding to International Patent Application No. PCT/US2008/065618, dated Oct. 16, 2008.
Written Opinion, corresponding to International Patent Application No. PCT/US2008/065618, dated Oct. 16, 2008.
European Patent Office; Examination Report; Oct. 25, 2010; issued in European Patent Application No. 08770022.5.
Korean Intellectual Property Office; Notice of Preliminary Rejection; Jun. 27, 2011; issued in Korean Patent Application No. 10-2010-7010559.
European Patent Office; Examination Report; Sep. 7, 2011; issued in European Patent Application No. 08770022.5.
State Intellectual Property Office, P.R. China; First Office Action; Oct. 13, 2011; issued in Chinese Patent Application No. 200880116237.9.

Affiliated with

Also associated with

Rating

Component with bonding adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Component with bonding adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component with bonding adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4314275