Component subjected to thermal stresses and having parts for int

Details Component subjected to thermal stresses and having parts for int Component subjected to thermal stresses and having parts for int

1979-11-20

1981-09-15

Stephan, Steven L.

Pipes and tubular conduits

Plural duct

Longitudinally extending common wall

60322, 60323, 138 37, 165 81, 220 89A, 285 4, 285187, 428 43, 428167, D03D 1300, F01N 700, F28F 700, B65D 6528

Patent

active

042891701

ABSTRACT:
A wall-like component which is supported at opposite ends and exposed to thermal stresses has an elongated bilateral enlargement extending substantially parallel to a plane in which the component lies. The enlargement is oriented substantially perpendicularly to an imaginary distance line between the opposite ends. An elongated cavity extends within and codirectionally with the enlargement. The cavity is offset with respect to the enlargement in the direction of one of the ends of the component. The cavity further has a dimension--measured in a direction perpendicular to the plane of the component--which is greater than the thickness of a component portion adjoining the enlargement. As a result, upon breakage of parts of the enlargement under the effect of forces derived from heat-caused expansion of the material of the component, there is obtained a free edge of the component portion and a trough-like part formed together by remaining parts of the enlargement and the cavity for receiving the free edge.

REFERENCES:
patent: 3798903 (1974-03-01), Mitchell et al.
patent: 3864909 (1975-02-01), Kern
patent: 4097071 (1978-06-01), Crawford et al.
patent: 4188784 (1980-02-01), Hall

Affiliated with

Also associated with

Rating

Component subjected to thermal stresses and having parts for int does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Component subjected to thermal stresses and having parts for int, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component subjected to thermal stresses and having parts for int will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-386302