Component stacking for integrated circuit electronic package

Details Component stacking for integrated circuit electronic package Component stacking for integrated circuit electronic package

2005-12-20

2008-03-11

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE25013, C257SE25030, C257SE23177, C257SE25031, C257S724000, C257S728000, C257S685000, C257S778000, C257S777000, C257S734000, C257S737000, C361S767000, C361S768000, C361S803000, C361S818000

Reexamination Certificate

active

07342308

ABSTRACT:
Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a component layer parallel to and aligned with a surface area of the substrate. An integrated circuit die is positioned adjacent to the component layer such that a face of the die is substantially parallel to the surface area of the substrate. The face of the die is aligned with at least a portion of the component layer, and terminals of the die are connected to the substrate.

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