Component self alignment

Details Component self alignment Component self alignment

1988-06-06

1989-06-06

Rowan, Kurt

Metal fusion bonding

Process

Plural joints

B23K 1900

Patent

active

048364355

ABSTRACT:
Alignment of leaded surface mount components to solder pads is enhanced by providing at least two soldered areas per lead, separated by a space of non-wettable material so that during component placement on the soldered areas there is a tendency for the components to self center as the leads fall between the raised soldered areas where they are retained during a reflow operation.

REFERENCES:
patent: 3778530 (1973-12-01), Reimann
patent: 3887760 (1975-06-01), Krieger
patent: 4494688 (1985-01-01), Hatada
patent: 4515304 (1985-05-01), Berger
patent: 4600137 (1986-07-01), Comerford
patent: 4605153 (1986-08-01), Van Den Brekel

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