Component retention with distributed compression

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C165S080200, C165S080300, C165S185000, C257S719000, C361S704000, C361S710000, C439S487000

Reexamination Certificate

active

07826229

ABSTRACT:
A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.

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patent: 2004/0247925 (2004-12-01), Cromwell
patent: 2004/0257771 (2004-12-01), Shinotou
patent: 2005/0007748 (2005-01-01), Callahan et al.
patent: 2007/0030652 (2007-02-01), Chen

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