Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2000-08-28
2003-08-19
Hail, III, Joseph J. (Department: 3723)
Metal working
Method of mechanical manufacture
Electrical device making
C029S827000, C029S823000, C029S893000, C029S834000
Reexamination Certificate
active
06606788
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a component recognizing method and apparatus for executing positional detection or quality check (good or no good) of connection portions such as leads and electrodes existing on the mounting surface of electronic components to be mounted during component mounting for automatically mounting the electronic component on a printed board or a liquid crystal or plasma display panel board. The present invention additionally relates to an electronic component mounting method for mounting the electronic component on a board on the basis of positional information of the connection portions such as the leads and electrodes existing on the mounting surface of the electronic component detected by the above component recognizing method. The present invention further relates to an electronic component mounting apparatus for mounting the electronic component on the board on the basis of the positional information of the connection portions such as the leads and electrodes existing on the mounting surface of the electronic component detected by the above component recognizing apparatus.
BACKGROUND ART
Conventionally, with regard to the component recognizing method of this type, there have been known various structures. For example, there has been considered one that applies a visible light to an electronic component, receives light reflected from the object by means of a CCD camera and executes the positional detection of the connection portions such as the leads and electrodes existing on the mounting surface of the electronic component.
However, the above-mentioned structure has had the following issue. If a projection or the like exists near the leads and electrodes existing on the mounting surface of the electronic component and the visible light is reflected off the projection, then the light reflected off the projection or the like enters the CCD camera in addition to the light reflected on the leads, electrodes and the like. The projection or the like becomes noise for the connection portions, such as the leads and electrodes, to be recognized, for which the projection might be erroneously recognized as a lead or an electrode.
Accordingly, it is an object of the present invention to solve the above-mentioned issue and provide a component recognizing method and apparatus capable of correctly obtaining the positional information of the connection portions of an electronic component without recognizing a projection or the like located near the connection portions such as leads and electrodes existing on the mounting surface of the electronic component as well as an electronic component mounting method and apparatus capable of correctly mounting the electronic component on the basis of positional information of the connection portions obtained correctly.
FIG. 41
is a schematic perspective view of a prior art electronic component mounting apparatus.
In
FIG. 41
are shown a main body
1
of an electronic component mounting apparatus, electronic components (occasionally abbreviated to “components” hereinafter)
2
to be mounted by the present mounting apparatus, a tray
4
a
on which the components
2
are placed, a tray supply section
4
that serves as a component supply section for automatically supplying the components
2
placed on the tray
4
a
, a head section
7
(nozzle
7
a
) for sucking one of the electronic components
2
in a mounting stage, a robot on the X-axis side (abbreviated to an X-axis robot hereinafter) that moves the head section
7
in the X-axis direction and constitutes part of an X-Y robot, robots
6
a
and
6
b
on the Y-axis side (abbreviated to Y-axis robots hereinafter) that move the head section
7
in the Y-axis direction and constitute part of the X-Y robot with the X-axis robot
5
, a CCD camera
3
A, and a height sensor
8
A. The reference numeral
9
denotes a printed board to be mounted with the components
2
.
FIG. 25
shows an example of the electronic component
2
to be mounted by the above-mentioned electronic component mounting apparatus. This electronic component
2
has a plurality of leads
2
a
on the left-hand and right-hand sides of a component body
2
b
, and the lead tips
2
c
of the leads
2
a
are mounted on the board
9
.
In the prior art electronic component mounting apparatus, the CCD camera
3
A is used for two-dimensional positional detection of the electronic component
2
that is the object, and the height sensor
8
A is used for inspecting the floating of the leads of the electronic component
2
.
As shown in
FIG. 42
, this height sensor
8
A is to measure the height of the object at one specified point. The height sensor
8
A shown in
FIG. 42
is provided with a laser light source
8
a
, a focusing lens
8
c
for focusing the reflected light (scattered light) of the laser beam that has been emitted from this laser light source
8
a
and impinges on the electronic component
2
that is the object and a semiconductor position sensitive detector (abbreviated to PSD hereinafter)
8
d
that serves as a position detecting device on which the reflected light of the laser beam impinging on the lead tip
2
c
of the electronic component
2
is focused through the focusing lens
8
c
. The PSD
8
d
generates an electric signal correlated with the position of the focused light.
The prior art component recognizing method will be described next on the basis of the flowchart shown in
FIG. 43
sequentially from Step S
71
to Step S
79
.
Step S
71
: The electronic component
2
is sucked by the nozzle
7
a.
Step S
72
: The luminance image of the electronic component
2
is captured in the position of the CCD camera
3
A.
Step S
73
: The position of the electronic component
2
is detected by processing this luminance image.
Step S
74
: The program flow jumps to Step S
78
when no inspection is executed on the floating of the leads
2
a
of the electronic component
2
.
Step S
75
: The electronic component
2
is moved so that the tips
2
c
of the leads
2
a
of the electronic component
2
each consistently come into the measurement position of the height sensor
8
A, and then, height data of the lead tips
2
c
are measured. In the case of the electronic component
2
shown in
FIG. 25
, the two lines P
1
and P
2
shown in
FIG. 25
are the height measurement lines of the lead tips
2
c
, and these measurement lines P
1
and P
2
are determined by the positional detection executed by the CCD camera
3
A. First, the height measurement of the lead tips
2
c
of one side is executed along the first line P
1
by moving the nozzle
7
a
in the X-axis direction, and after rotating the nozzle
7
a
by 180°, the height measurement of the lead tips
2
c
of the other side is executed along the second line P
2
by moving the nozzle
7
a
in the X-axis direction. In the case where the electronic component
2
is a QFP component, the heights of the lead tips
2
c
of the four sides are taken in by segmentally executing a linear movement four times. In this case, the electronic component
2
are rotated by 90 degrees three times around the nozzle
7
a
for suction use.
Step S
76
: Positions of three lead tips
2
c
that are brought into contact with a theoretical imaginary surface when the electronic component
2
is mounted on the theoretical imaginary surface are calculated from three-dimensional positions (X, Y, Z) of all the lead tips
2
c
, and the imaginary surface is expressed by an expression. Then, distances of the three-dimensional positions (X, Y, Z) of all the lead tips
2
c
from the imaginary surface, i.e., the lead floating amounts are calculated.
Step S
77
: It is decided whether each of these lead floating amounts is exceeding a predetermined reference value. When the lead floating amount is exceeding the predetermined reference value, the program flow proceeds to Step S
79
. When all of the lead floating amounts are not exceeding the predetermined reference value, the program flow proceeds to Step S
78
.
Step S
78
: In the case of an electronic component that is not required to be i
Hachiya Eiichi
Morimoto Masamichi
Noudo Akira
Sano Kimiaki
Tanabe Atsushi
Grant Alvin J.
Hail III Joseph J.
Matsushita Electric - Industrial Co., Ltd.
Wenderoth , Lind & Ponack, L.L.P.
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