Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent
1991-11-27
1992-09-22
Heinrich, Samuel M.
Metal fusion bonding
Process of disassembling bonded surfaces, per se
228 19, 228 47, 156584, B23K 100, B23K 300
Patent
active
051489694
ABSTRACT:
This invention relates to an apparatus and method by which electronic components can be reclaimed from printed circuit boards. In the preferred embodiment, the reclamation system includes a conveyor which grasps the edges of the boards and holds them at an angle so that the component sides of the boards are facing downward. The conveyor carries the boards past infrared panels which heat each board, so that the solder bonding the components to a given board is made to reflow. While the solder is in a reflow state, each board is struck with a tapper, the impact of which has a tendency to dislodge the components. Falling components are caught in bins where they can be collected. In addition, the reclamation system is configured such that a number of operators are able to work in front of the boards passing on the conveyor. Therefore, if the tapper fails to dislodge any components on a given board, an operator can manually remove the components before the board is itself removed from the conveyor. Given that the system accommodates the simultaneous processing of a number of boards, a high volume throughput can be achieved.
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Boucher Bernard J.
Brochu Douglas A.
Dinsmore Kerry S.
Malesky John A.
Digital Equipment Corporation
Heinrich Samuel M.
Myrick Ronald E.
Skladony William P.
Young Barry N.
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