Component placement

Details Component placement Component placement

2001-04-04

2003-02-25

Ramirez, Ramon O. (Department: 3632)

Supports

With means to facilitate installation, repair, or...

Reexamination Certificate

active

06523801

ABSTRACT:

TECHNICAL FIELD
This invention relates to component placement.
BACKGROUND
In populating printed circuit boards (PCB), components are placed in solder paste on a board using high-speed automated equipment. The equipment typically includes a table capable of precise movement in an x-y plane and devices for placing components on PCBs that are held on the table using fixtures. One such component placement machine is the Fuji CP642 Chip Placer sold by Fuji North America, Vernon Hills, Ill.
Referring to
FIG. 1
, one way to hold a PCB
10
for placement of components
12
on a primary side
13
of the PCB is to support the board
10
on a secondary side
14
using an array of height-adjustable pins
15
attached to a phenolic plate
16
that is mounted on the x-y table
17
of the component placement machine (not shown).
The primary side of a PCB is the side on which components are placed first. The secondary side of a board may receive additional components after components on the primary side have been mounted.
Referring to
FIG. 2
, the height of each pin
15
may be adjusted independently during set-up before a manufacturing run. Typically, each pin is adjusted by hand and, as a result, the height of a given pin
15
may be adjusted incorrectly leaving gaps
18
. The resulting inconsistent support may cause bending of board
10
and lead to damage of both PCB
10
and placed components
12
, increasing manufacturing costs. When a pin is too high, the component placement machine may damage (e.g., crack) components
12
or PCB
10
. When a pin is too low, a component may be seated improperly in the solder paste or not be placed at all. Setting the pins is time consuming.


REFERENCES:
patent: 5309324 (1994-05-01), Herandez et al.
patent: 5320226 (1994-06-01), Merrill
patent: 6189876 (2001-02-01), Frazier
patent: 6330996 (2001-12-01), Yo et al.
US 2002/0029900 A1 Wimberger Friedl et al. Published Mar. 14, 2002.*
Fuji CP-6 High Speed Chip Placerbrochure.
Fuji Chip Placer CP-6Specification.www.caro.net/dis ufj.htm.

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