Component packaging apparatus, systems, and methods

Details Component packaging apparatus, systems, and methods Component packaging apparatus, systems, and methods

2008-04-29

2008-04-29

Hoang, Quoc (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S643000, C257SE21024, C257SE23007, C257SE23119

Reexamination Certificate

active

10750459

ABSTRACT:
Dielectric materials comprising release agents are described. Also described are a process for improving the proccessability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.

REFERENCES:
patent: 4474920 (1984-10-01), Kyminas et al.
patent: 4723903 (1988-02-01), Okazaki et al.
patent: 5534593 (1996-07-01), Friedman
patent: 6030556 (2000-02-01), DePuydt et al.
patent: 6030692 (2000-02-01), Auger
patent: 6210514 (2001-04-01), Cheung et al.
patent: 6454970 (2002-09-01), Ohman et al.
patent: 6869557 (2005-03-01), Wago et al.
patent: 2004/0126547 (2004-07-01), Coomer
patent: 2004/0202865 (2004-10-01), Homola et al.
patent: 2001/0116387 (2005-06-01), Davison et al.
patent: 2006/0051453 (2006-03-01), Imatomi
“Light Duty : Managing MOEMS”, www.stcsm.gov.cn,(Jul. 19, 2001).
“U.S. Appl. No. 10/750,534 Final Office Action mailed Dec. 13, 2006”, 14 pgs.
“U.S. Appl. No. 10/750,534 Non-final office action mailed May 9, 2006”, 16 pgs.
“U.S. Appl. No. 10/750,534 Non-Final Office Action mailed Aug. 21, 2007”, OARN, 17 pages.
“U.S. Appl. No. 10/750,534 Response filed Mar. 2, 2007 in response to Final Office Action mailed Dec. 12, 2006”, 9 pgs.
“U.S. Appl. No. 10/750,534 Response filed Oct. 10, 2006 to non-final office action mailed May 9, 2006”, 12 pgs.

Affiliated with

Also associated with

Rating

Component packaging apparatus, systems, and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Component packaging apparatus, systems, and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component packaging apparatus, systems, and methods will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3912053