Component packaging apparatus, systems, and methods

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

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Details

C257S643000, C257SE21024, C257SE23007, C257SE23119

Reexamination Certificate

active

10750459

ABSTRACT:
Dielectric materials comprising release agents are described. Also described are a process for improving the proccessability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.

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