Component packaging apparatus, systems, and methods

Details Component packaging apparatus, systems, and methods Component packaging apparatus, systems, and methods

2008-04-29

2008-04-29

Hoang, Quoc (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S643000, C257SE21024, C257SE23007, C257SE23119

Reexamination Certificate

active

07365414

ABSTRACT:
Dielectric materials comprising release agents are described. Also described are a process for improving the proccessability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.

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