Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2011-03-08
2011-03-08
Flanigan, Allen J (Department: 3744)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104330, C165S080400, C361S699000, C361S700000
Reexamination Certificate
active
07900692
ABSTRACT:
In an electrical component package provided with a liquid-cooled heat exchanger, a main-body plate of the package and a crowning member that are composed of metal plates are joined together, forming a hollow part therebetween for use as a liquid-cooled heat exchanger in which a working fluid is sealed. A concavity for use in mounting an electrical component to be cooled is formed on the outer surface portion of the main-body plate of the package disposed opposite to the hollow part. An inner surface portion that faces into the hollow part of the main-body plate of the package is carved out using a carving tool, whereby fins are formed at a fine pitch on the inner surface portion. Minute channels for moving the working fluid are formed between the fins. Therefore, a flat electrical component package can be provided with a liquid-cooled heat exchanger that has excellent heat-radiating functionality.
REFERENCES:
patent: 3734173 (1973-05-01), Moritz
patent: 4046190 (1977-09-01), Marcus et al.
patent: 5990552 (1999-11-01), Xie et al.
patent: 6216343 (2001-04-01), Leland et al.
patent: 6293333 (2001-09-01), Ponnappan et al.
patent: 6725910 (2004-04-01), Ishida et al.
patent: 6752204 (2004-06-01), Dishongh et al.
patent: 2001/0030039 (2001-10-01), Copeland et al.
patent: 2002/0189790 (2002-12-01), Wong
patent: 2003/0043544 (2003-03-01), Nelson et al.
patent: 2005/0056403 (2005-03-01), Norlin et al.
patent: 2005/0199372 (2005-09-01), Frazer et al.
patent: 2006/0213648 (2006-09-01), Chen et al.
patent: 2001-127201 (2001-05-01), None
Flanigan Allen J
Flynn ,Thiel, Boutell & Tanis, P.C.
Nakamura Seisakusho Kabushikigaisha
LandOfFree
Component package having heat exchanger does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Component package having heat exchanger, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component package having heat exchanger will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2661298