Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-01-24
1999-09-14
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156288, 156291, 29830, B32B 3100
Patent
active
059518030
ABSTRACT:
A method of making printed circuit boards and components there of comprising laminating a sheet of copper foil and a sheet of aluminum or the like. A band of flexible adhesive joins the sheets around their borders and creates a protected central zone at the interface of the sheets. Islands of adhesive are located inwardly of the edges of the sheets through which tooling pin holes may be formed to facilitate handling of the foil. The boards are made by assembling a plurality of the components alternating between dielectric layers and layers of copper foil.
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IBM Technical Disclosure Bulletin, vol. 27, No. 8, Jan. 85 by Pohl and Schmid.
Johnson & Johnston Associates, Inc.
Osele Mark A.
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