Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-01-22
2008-01-22
Patel, Ishwar (I. B.) (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S262000
Reexamination Certificate
active
07321099
ABSTRACT:
To provide a component mounting substrate and a component mounting structure which absorb stresses caused by impact or by the difference in the thermal extension coefficient between substrate and component, without increasing the required accuracy in soldering the substrate and the component together. The substrate, which is to be mounted with a component having one or more solder joints via which the component is connected to the substrate, has a depressed part thereof formed on its component side, on which one or more electrodes are provided to be closely joined with the solder joints. The depressed part is filled with a filling material with rigidity different from that of a material making up the substrate body, such that the filling material is flush or almost flush with the surface of the component side of the substrate.
REFERENCES:
patent: 5126820 (1992-06-01), Brown
patent: 5828116 (1998-10-01), Ao
patent: 6097089 (2000-08-01), Gaku et al.
patent: 6153930 (2000-11-01), Hori
patent: 6384472 (2002-05-01), Huang
patent: 6562660 (2003-05-01), Sakamoto et al.
patent: 6703696 (2004-03-01), Ikenaga et al.
patent: 6787923 (2004-09-01), Tan et al.
patent: 2001/0045626 (2001-11-01), Hirose
patent: 60-140782 (1985-07-01), None
patent: 5-226792 (1993-09-01), None
patent: 9-63912 (1997-03-01), None
patent: 2000-277923 (2000-10-01), None
patent: 2001-332646 (2001-11-01), None
patent: 2003-124389 (2003-04-01), None
patent: 2003273479 (2003-09-01), None
patent: WO2004026010 (2005-03-01), None
Fujitsu Limited
Patel Ishwar (I. B).
Westerman, Hattori, Daniels & Adrian , LLP.
LandOfFree
Component mounting substrate and structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Component mounting substrate and structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component mounting substrate and structure will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2806864