Component mounting process for printed circuit boards

Details Component mounting process for printed circuit boards Component mounting process for printed circuit boards

1988-10-21

1989-10-17

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29739, 29832, 361414, H05K 336

Patent

active

048737640

ABSTRACT:
A process is disclosed for use in the manufacture of layered printed circuit board assembly having first and second layers with electrically conductive patterns thereon. The assembly has at least one inner layer between the first and second layers for receiving and retaining a surface-mount device inserted through aligned holes in the layers. The device has an electrically conductive cap at each end for electrical connection to the conductive patterns. The inner layer physically retains the surface-mount device in place pending the electrical connection of the end caps to the conductive patterns, and by virtue of its being inherently compliant and yielding, provides for physically retaining the surface-mount device in place pending the electrical and mechanical connection of the electrically conductive end caps to the conductive patterns.

REFERENCES:
patent: 4449769 (1984-05-01), Kobeyashi et al.
patent: 4649461 (1987-03-01), Matsuta
patent: 4725920 (1988-02-01), Ijichi et al.
"Japan Unveils Below-the-Surface-Mount Technology." Electronic Packaging and Production Magazine, May, 1987.

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