Component mounting method employing temperature maintenance...

Details Component mounting method employing temperature maintenance... Component mounting method employing temperature maintenance...

2005-07-26

2005-07-26

Chang, Rick Kiltae (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S739000, C029S740000, C029S743000, C029S833000, C414S737000, C414S751100, C414S752100, C901S040000, C294S064200

Reexamination Certificate

active

06920687

ABSTRACT:
A component mounting method for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

REFERENCES:
patent: 6099678 (2000-08-01), Kotato et al.
patent: 6122823 (2000-09-01), Kira et al.

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