Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-03-28
2006-03-28
Mehta, Bhavesh M. (Department: 2625)
Image analysis
Applications
Manufacturing or product inspection
C382S149000, C382S151000, C438S016000, C348S087000, C257SE23179, C356S237100
Reexamination Certificate
active
07020322
ABSTRACT:
A number of recognition operations for a circuit-formed substrate as a whole is reduced by concurrently recognizing a bad mark and an individual substrate mark in the course of a recognition process of a single or a plurality of individual substrate(s) provided by sectioning the circuit-formed substrate. Results of the recognition of an inclination and dislocation of the circuit-formed substrate are used to control a position of a substrate-recognition camera which recognizes the individual substrate, thereby reducing a rate of occurrence of recognition errors. When a component of recognition marks or the individual substrate mark is captured within a visual field of the substrate-recognition camera, a position of a corresponding one of these recognized marks is specified, and such a mark is again recognized, and thus, the occurrence of a recognition error can be inhibited.
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Kido Kazuo
Kuribayashi Takeshi
Nakano Tomoyuki
Odera Koji
Carter Aaron
Mehta Bhavesh M.
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