Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-04-10
2007-04-10
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S834000, C029S836000, C029S740000, C029S743000
Reexamination Certificate
active
11433357
ABSTRACT:
Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.
REFERENCES:
patent: 3650140 (1972-03-01), Zmuda
patent: 4231153 (1980-11-01), Browne
patent: 4480780 (1984-11-01), Claeskens et al.
patent: 4573262 (1986-03-01), Dornes et al.
patent: 4624050 (1986-11-01), Hawkswell
patent: 4631812 (1986-12-01), Young
patent: 4875285 (1989-10-01), Haan et al.
patent: 5002448 (1991-03-01), Kaijima et al.
patent: 5115559 (1992-05-01), Oyama
patent: 5191702 (1993-03-01), Goedecke et al.
patent: 5233745 (1993-08-01), Morita
patent: 5323528 (1994-06-01), Baker
patent: 5410801 (1995-05-01), Shiloh et al.
patent: 5456001 (1995-10-01), Mori et al.
patent: 5541834 (1996-07-01), Tomigashi et al.
patent: 5579572 (1996-12-01), Kashiwagi et al.
patent: 5651176 (1997-07-01), Ma et al.
patent: 5692292 (1997-12-01), Asai et al.
patent: 5711065 (1998-01-01), Asai et al.
patent: 5740604 (1998-04-01), Kitamura et al.
patent: 5741114 (1998-04-01), Onodera
patent: 5778525 (1998-07-01), Hata et al.
patent: 6408505 (2002-06-01), Hata et al.
patent: 6789310 (2004-09-01), Hata et al.
patent: 6935017 (2005-08-01), Hata et al.
patent: 7069648 (2006-07-01), Hata et al.
patent: 0 453 369 (1991-10-01), None
patent: 54-043381 (1979-04-01), None
patent: 60-7200 (1985-01-01), None
patent: 61-39000 (1986-03-01), None
patent: 63-178596 (1988-07-01), None
patent: 1-187898 (1989-07-01), None
patent: 2-54999 (1990-02-01), None
patent: 3-30499 (1991-02-01), None
patent: 03-131100 (1991-06-01), None
patent: 03-203294 (1991-09-01), None
patent: 06077693 (1994-03-01), None
patent: 07-22787 (1995-01-01), None
patent: 07-136875 (1995-05-01), None
patent: 1829131 (1993-07-01), None
patent: 85/03404 (1985-08-01), None
“A novel surface acoustic wave resonator for compact, low-cost oscillators”; Fleischmann, B.; Allen, D.; Ultrasoncis Symposium, 1990. Proceedings., IEEE; Dec. 4-7, 1990; pp. 95-98.
Hata Kanji
Yoshida Noriaki
Matsushita Electric - Industrial Co., Ltd.
Trinh Minh
LandOfFree
Component mounting method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Component mounting method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component mounting method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3781421