Component mounting method

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S832000, C228S180220

Reexamination Certificate

active

07353596

ABSTRACT:
In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

REFERENCES:
patent: 4951388 (1990-08-01), Eguchi et al.
patent: 5397423 (1995-03-01), Bantz et al.
patent: 5839187 (1998-11-01), Sato et al.
patent: 2004/0003891 (2004-01-01), Cheng et al.
patent: 9-082748 (1997-03-01), None
patent: 10-150075 (1998-06-01), None
patent: 10-209208 (1998-08-01), None
patent: 11-135572 (1999-05-01), None
patent: 2000-012717 (2000-01-01), None
patent: 2000-022394 (2000-01-01), None

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