Component mounting method

Details Component mounting method Component mounting method

2008-04-08

2008-04-08

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C228S180220

Reexamination Certificate

active

07353596

ABSTRACT:
In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

REFERENCES:
patent: 4951388 (1990-08-01), Eguchi et al.
patent: 5397423 (1995-03-01), Bantz et al.
patent: 5839187 (1998-11-01), Sato et al.
patent: 2004/0003891 (2004-01-01), Cheng et al.
patent: 9-082748 (1997-03-01), None
patent: 10-150075 (1998-06-01), None
patent: 10-209208 (1998-08-01), None
patent: 11-135572 (1999-05-01), None
patent: 2000-012717 (2000-01-01), None
patent: 2000-022394 (2000-01-01), None

Affiliated with

Also associated with

Rating

Component mounting method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Component mounting method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Component mounting method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2793906