Component mounting method

Details Component mounting method Component mounting method

2004-08-25

2008-10-21

Vo, Peter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S739000, C029S740000, C029S741000, C029S742000, C029S743000

Reexamination Certificate

active

07437818

ABSTRACT:
A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

REFERENCES:
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patent: 2001/0005602 (2001-06-01), Mimata et al.
patent: 2003/0071109 (2003-04-01), Arikado
patent: 56-94638 (1981-07-01), None
patent: 7-135228 (1995-05-01), None
patent: 2001-274596 (2001-10-01), None

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