Component mounting method

Details Component mounting method Component mounting method

2011-01-11

2011-01-11

Cleveland, Michael (Department: 1712)

Coating processes

Nonuniform coating

Applying superposed diverse coatings or coating a coated base

C427S058000, C427S096100, C427S108000, C427S140000, C427S256000, C427S258000, C427S261000, C427S265000, C427S269000, C427S287000, C427S300000, C029S831000, C029S832000, C029S834000, C438S106000, C438S107000, C438S125000, C438S126000

Reexamination Certificate

active

07867563

ABSTRACT:
The present invention is a method of mounting a plurality of components on a substrate. This component mounting method comprises the steps of (a) to (f): (a) preparing the substrate; (b) preparing a first liquid; (c) preparing a component-containing liquid containing the components and a second liquid, wherein the first liquid is insoluble in the second liquid and has a higher wettability than the second liquid with respect to the surfaces of the components, first regions, and a line having a shorter width than a minimum length of each of the components; (d) disposing the first liquid in the first regions and the line; (e) moving a squeegee for supplying a component-containing liquid to the substrate, relative to the substrate over the line from one edge to the other edge of the substrate to bring the component-containing liquid into contact with the first liquid disposed in the first regions; and (f) removing the first liquid and the second liquid from the substrate to dispose the components in the first regions.

REFERENCES:
patent: 6417025 (2002-07-01), Gengel
patent: 6507989 (2003-01-01), Bowden et al.
patent: 6872645 (2005-03-01), Duan et al.
patent: 6969690 (2005-11-01), Zhou et al.
patent: 2008/0293175 (2008-11-01), Torii
patent: 2009/0265929 (2009-10-01), Nakagawa et al.
patent: 2003-005212 (2003-01-01), None
patent: 2007-059559 (2007-03-01), None
patent: 4149507 (2008-07-01), None
patent: WO 2007/037381 (2007-04-01), None
patent: WO 2007/105405 (2007-09-01), None
Nakagawa, T., et al., “Controlled Deposition of Silicon Nanowires on Chemically Patterned Substrate by Capillary Force Using a Blade-Coating Method”, J. Phys. Chem. C, 2008, pp. 5390-5396, vol. 112, American Chemical Society.
Srinivasan, U., et al., “Microstructure to Substrate Self-Assembly Using Capillary Forces”, Journal of Microelectromechanical Systems, Mar. 2001, pp. 17-24, vol. 10 No. 1, IEEE.
Wang, D., et al., “Germanium nanowire field-effect transistors with SiO2and high-κ HfO2gate dielectrics”, Applied Physics Letters, Sep. 22, 2003, pp. 2432-2434, vol. 83 No. 12, American Institute of Physics.
Huang, Y., et al., “Directed Assembly of One-Dimensional Nanostructures into Functional Networks”, Science, Jan. 26, 2001, pp. 630-633, vol. 291.
Lienemann, J., et al., “Modeling, Simulation, and Experimentation of a Promising New Packaging Technology: Parallel Fluidic Self-Assembly of Microdevices”, Sensors Update, 2004, pp. 3-43, vol. 13.
Drobac, S., et al., “Fluidic Self-Assembly Could Change the Way FPDs Are Made”, Information Display, 1999, pp. 12-16, SID.

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