Component mounting control method

Details Component mounting control method Component mounting control method

2006-05-30

2006-05-30

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S833000, C029S840000, C029S841000

Reexamination Certificate

active

07051431

ABSTRACT:
In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection apparatus, and when the mounting inspection apparatus confirms that a chip component is not present, it is firstly confirmed whether or not a mounting trace of a chip component is present on solder, and a mounting nozzle is specified which has mounted a chip component found to be a missing component according to the confirmation result. Thereafter, the confirmation result is transmitted to a controller of the small component mounting apparatus. The controller selects and obtains coping information from a data base based on the confirmation result, and the information is shown on a display.

REFERENCES:
patent: 4806922 (1989-02-01), McLaughlin et al.
patent: 5714252 (1998-02-01), Hogerton et al.
patent: 6926796 (2005-08-01), Nishida et al.
patent: 08-292018 (1996-11-01), None

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