Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2005-01-24
2010-02-16
Strege, John B (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S149000
Reexamination Certificate
active
07664311
ABSTRACT:
There is provided a component mounting inspecting apparatus which can automatically set a solder bridge inspection region (an inspection point) and output an optimum inspection result of a solder bridge. The component mounting board inspecting apparatus for inspecting a solder bridge of an electronic circuit board, in which a plurality of electrode pads are formed at predetermined spaced intervals and cream solder is applied on the electrode pads, includes a mechanism for automatically determining a distance between adjacent electrode pads and a mechanism for automatically setting a solder bridge inspection point if the distance between the adjacent electrode pads is equal to or shorter than a threshold value.
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Igarashi Yutaka
Ootsuki Hiroshi
Yamasaki Hiroshi
Rader & Fishman & Grauer, PLLC
Sony Corporation
Strege John B
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