Component mounting apparatus including a polishing device

Details Component mounting apparatus including a polishing device Component mounting apparatus including a polishing device

2007-05-22

2007-05-22

Chang, Richard (Department: 3726)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S832000, C029S839000, C029S840000, C451S005000, C451S035000, C451S163000, C451S164000, C451S165000, C451S143000, C228S001100, C228S205000, C228S110100, C228S008000, C228S102000, C156S580100, C156S580200

Reexamination Certificate

active

10375953

ABSTRACT:
Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (3). Friction is thereby generated between metal interconnects (5), (6) whereby the component (3) is bonded on circuit substrate. Suction nozzle (14) for handling components is made of stainless steel and has a working face (14a) provided with a hardened layer (14b), or alternatively, suction nozzle (14) may have a suction head (14c) having a working face (14a) made of cemented carbide. Working face (14a) of suction nozzle (14) is refined by polishing as required during the mounting operation.

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