Component mounting apparatus employing temperature...

Details Component mounting apparatus employing temperature... Component mounting apparatus employing temperature...

2007-11-06

2007-11-06

Tugbang, A. Dexter (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S741000, C029S743000, C029S832000, C029S833000, C700S205000

Reexamination Certificate

active

11172583

ABSTRACT:
A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

REFERENCES:
patent: 5336935 (1994-08-01), Shitanda et al.
patent: 5850683 (1998-12-01), Okazaki et al.
patent: 6122823 (2000-09-01), Kira et al.
patent: 6390281 (2002-05-01), Nagai et al.

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