Component mounting apparatus and method

Details Component mounting apparatus and method Component mounting apparatus and method

2008-12-03

2011-10-04

Tucker, Philip (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S312000, C156S562000

Reexamination Certificate

active

08029638

ABSTRACT:
A component mounting apparatus includes: a plurality of pressure-bonding units which are arrayed in line and each of which includes a pressure-bonding head for pressure-bonding a component to a component pressure-bonding area of the substrate, and an edge-portion support member for supporting an edge portion of the substrate during the pressure bonding; a guide support member for supporting the pressure-bonding units so that their movement along the edge portion for execution of substrate pressure-bonding can be guided; a common head up/down unit for integrally moving up and down the individual pressure-bonding heads; and a plurality of unit-moving devices which are provided for the plurality of pressure-bonding units, individually and respectively, to move the pressure-bonding units along the edge portion so that placement of the pressure-bonding units is changed.

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International Preliminary Report on Patentability (Chapter II) (in English) issued Aug. 12, 2010 in International (PCT) Application No. PCT/JP2008/003579.
International Preliminary Report on Patentability and Written Opinion of the International Searching Authority issued Aug. 12, 2010 in International (PCT) Application No. PCT/JP2008/003579 (in English).
International Search Report issued Feb. 17, 2009 in International (PCT) Application No. PCT/JP2008/003579.

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