Component mounting apparatus and component mounting method

Details Component mounting apparatus and component mounting method Component mounting apparatus and component mounting method

2007-11-06

2007-11-06

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S833000, C029S834000

Reexamination Certificate

active

11426719

ABSTRACT:
In a component mounting apparatus in which integrated components having a chip-on-chip structure are formed by mounting upper chips on lower chips. The lower chips picked up from a component carrying-in unit by a component carrying-in head are placed on a mounting stage, and the upper chips picked up from a second component tray by a component transporting head are vertically flipped around a rotation axis and transferred to a mounting head at a component transferring position, then the upper chips held by the mounting head are descended and mounted by solder bonding on the lower chips held by the mounting stage at a component mounting position. Integrated components formed by mounting are carried out of the mounting stage by the component transporting head and stored in a first component tray in a component storing unit.

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patent: 7098073 (2006-08-01), Mangrum
patent: 3132353 (2000-11-01), None

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