Component mounting apparatus and component mounting method,...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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Reexamination Certificate

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07089073

ABSTRACT:
Transfer of liquid crystal panels to subsequent processes is performed with the panels placed on transfer arms and held by suction pads. A small suction force can be sufficient, and a suction irregularity is prevented. The transfer arms are arranged at a lower side of the liquid crystal panels, thus not obstructing the liquid crystal panels. In arranging the liquid crystal panels at an image pickup device, a panel holding device is controlled to be driven so as to position panel marks to a bonding height position while negating a deflection amount of the liquid crystal panels, and furthermore a component holding device is controlled to be driven so as to position component marks to the bonding height position and to mount electronic components to the liquid crystal panels at the bonding height position.

REFERENCES:
patent: 5004399 (1991-04-01), Sullivan et al.
patent: 5501005 (1996-03-01), Onitsuka
patent: 5509771 (1996-04-01), Hiroki
patent: 5639009 (1997-06-01), Abe
patent: 5677749 (1997-10-01), Tsubota et al.
patent: 5764013 (1998-06-01), Yae
patent: 5765889 (1998-06-01), Nam et al.
patent: 5864944 (1999-02-01), Kashiwagi et al.
patent: 5867897 (1999-02-01), Mimura et al.
patent: 5879040 (1999-03-01), Nagai et al.
patent: 5923408 (1999-07-01), Takabayashi
patent: 5963449 (1999-10-01), Ota et al.
patent: 5984293 (1999-11-01), Abrahamson et al.
patent: 6012509 (2000-01-01), Nonaka
patent: 6036568 (2000-03-01), Murouchi et al.
patent: 6101709 (2000-08-01), Shiota
patent: 6152677 (2000-11-01), Tateyama et al.
patent: 6176007 (2001-01-01), Kashiwagi et al.
patent: 6257564 (2001-07-01), Avneri et al.
patent: 6304311 (2001-10-01), Egami et al.
patent: 6339321 (2002-01-01), Yamashita et al.
patent: 6446948 (2002-09-01), Allen
patent: 6507997 (2003-01-01), Kawai et al.
patent: 6535291 (2003-03-01), Skunes et al.
patent: 6559928 (2003-05-01), Aoki
patent: 6611249 (2003-08-01), Evanicky et al.
patent: 6621551 (2003-09-01), Matsuzawa
patent: 6631552 (2003-10-01), Yamaguchi
patent: 6664549 (2003-12-01), Kobayashi et al.
patent: 6665043 (2003-12-01), Okuyama et al.
patent: 6708402 (2004-03-01), Hirano et al.
patent: 6718608 (2004-04-01), Wah et al.
patent: 6744499 (2004-06-01), Skunes et al.
patent: 6762826 (2004-07-01), Tsukamoto et al.
patent: 6836316 (2004-12-01), Tokita
patent: 6860801 (2005-03-01), Yang et al.
patent: 0-734-056 (1996-09-01), None
patent: 04-352442 (1992-12-01), None
patent: 07-088730 (1995-04-01), None
patent: 09-219357 (1997-08-01), None
patent: 11-188669 (1999-07-01), None
patent: JP 2001-210999 (2001-08-01), None
patent: 1999-23439 (1999-03-01), None
patent: 1999-88676 (1999-12-01), None
patent: 10-0237662 (2000-01-01), None
“General-Purpose, High-Force, Vacuum Fixture for the Printed Circuit Card Fabrication Industry”, IBM Technical Disclosure Bulletin, US, IBM Corp. New York, vol. 35, No. 1A, Jun. 1, 1992, pp. 215-216.

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